電気銅めっき制御槽における電流密度分布推定法

Translated title of the contribution: An Estimation Method of Current Density Distribution for Copper Electroplating Control Cell

岸本喜直, 大塚年久, Yukiyoshi KOBAYASHI, 天谷賢治

Research output: Contribution to journal › Misc

Translated title of the contribution	An Estimation Method of Current Density Distribution for Copper Electroplating Control Cell
Original language	Japanese
Pages (from-to)	503 - 506
Journal	Journal of The Surface Finishing Society of Japan
Volume	63
Issue number	8
State	Published - Aug 2012

Cite this

@article{b4428d2295114ceba69c1d75275d2cd5,

title = "電気銅めっき制御槽における電流密度分布推定法",

author = "岸本喜直 and 大塚年久 and Yukiyoshi KOBAYASHI and 天谷賢治",

year = "2012",

month = aug,

language = "Japanese",

volume = "63",

pages = "503 -- 506",

journal = "Journal of The Surface Finishing Society of Japan",

issn = "0915-1869",

publisher = "The Surface Finishing Society of Japan",

number = "8",

}

TY - JOUR

T1 - 電気銅めっき制御槽における電流密度分布推定法

AU - 岸本喜直, null

AU - 大塚年久, null

AU - KOBAYASHI, Yukiyoshi

AU - 天谷賢治, null

PY - 2012/8

Y1 - 2012/8

M3 - Misc

SN - 0915-1869

VL - 63

SP - 503

EP - 506

JO - Journal of The Surface Finishing Society of Japan

JF - Journal of The Surface Finishing Society of Japan

IS - 8

ER -