GOI基板作製における貼り合わせ後熱処理の影響

Translated title of the contribution: Influences of thermal annealing after bonding on GOI fabrication

柴田翔吾, Ryousuke ISHIKAWA, 星裕介, 澤野憲太郎

Research output: Contribution to journal › Misc

Translated title of the contribution	Influences of thermal annealing after bonding on GOI fabrication
Original language	Japanese
Pages (from-to)	-
Journal	応用物理学会春季学術講演会講演予稿集(CD-ROM)
Volume	67th
State	Published - 2020

Cite this

@article{5fbe5bdb24314d82bf7de948de542229,

title = "GOI基板作製における貼り合わせ後熱処理の影響",

author = "柴田翔吾 and Ryousuke ISHIKAWA and 星裕介 and 澤野憲太郎",

year = "2020",

language = "Japanese",

volume = "67th",

pages = "--",

journal = "応用物理学会春季学術講演会講演予稿集(CD-ROM)",

issn = "2436-7613",

publisher = "The Japan Society of Applied Physics",

}

TY - JOUR

T1 - GOI基板作製における貼り合わせ後熱処理の影響

AU - 柴田翔吾, null

AU - ISHIKAWA, Ryousuke

AU - 星裕介, null

AU - 澤野憲太郎, null

PY - 2020

Y1 - 2020

M3 - Misc

SN - 2436-7613

VL - 67th

SP - -

JO - 応用物理学会春季学術講演会講演予稿集(CD-ROM)

JF - 応用物理学会春季学術講演会講演予稿集(CD-ROM)

ER -