Quality of SiO2 and of SiGe formed by oxidation of Si/Si0.7Ge0.3 heterostructure using atomic oxygen at 400 degrees C

H Nohira, T Kuroiwa, A Nakamura, Y Hirose, Y Hirose, J Mitsui, W Sakai, K Nakajima, M Suzuki, K Kimura, K Sawano, K Nakagawa, Y Shiraki, T Hattori, Hiroshi NOHIRA

Research output: Contribution to journalArticle

Abstract

The oxidation of a 2.7-nm-thick layer of Si formed on a layer of Si0.7MGe0.3 using atomic oxygen at 400 degreesC was studied with the aid of angle-Tesolved X-ray photoelectron spectroscopy and high-resolution Rutherford backscattering spectroscopy. Analysis of the measurement results revealed that: (1) an appreciable number of Ge atoms diffused into the Si layer during the formation of a 3-nm-thick Si layer on the Si0.7Ge0.3 layer at 720 degreesC; (2) when the entire Si layer was oxidized, 1.8% of the Si layer remained in the SiO2 in the form of Si0.7Ge0.3 alloy; and (3) an abrupt compositional transition took place at the SiO2/SiGe interface. (C) 2004 Elsevier B.V. All rights reserved.
Translated title of the contributionQuality of SiO2 and of SiGe formed by oxidation of Si/Si0.7Ge0.3 heterostructure using atomic oxygen at 400 degrees C
Original languageEnglish
Pages (from-to)134 - 138
JournalApplied Surface Science
Volume237
Issue number1-4
DOIs
StatePublished - Oct 2004

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